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Computer Supported Cooperative Work in Design

TC Leadership

Jean-Paul A. Barthès

TC Co-Chair

Jean-Paul A. Barthès (This email address is being protected from spambots. You need JavaScript enabled to view it.)
Université de Technologie de Compiègne, France

Weiming Shen

TC Co-Chair

Weiming Shen (This email address is being protected from spambots. You need JavaScript enabled to view it.)
National Research Council, Canada

Amy Trappey

TC Co-Chair

Amy Trappey (This email address is being protected from spambots. You need JavaScript enabled to view it.)
National Tsing Hua University, Taiwan

Junzhou Luo

TC Co-Chair

Junzhou Luo (This email address is being protected from spambots. You need JavaScript enabled to view it.)
Southeast University, China



Jano de Souza

TC Co-Chair

Jano de Souza (This email address is being protected from spambots. You need JavaScript enabled to view it.)
Federal University of Rio de Janeiro, Brazil


Our Goal

The Technical Committee on Computer Supported Cooperative Work in Design (CSCWD) is an international special interest group of researchers working in the fields of collaboration technologies and applications to the design of processes, products, systems, and services in industries and societies. Collaboration technologies include theories, methods, mechanisms, protocols, software tools, platforms, and services that support collaboration and coordination among people, software and hardware systems. Related fields of research include collaborative workflows, collaborative virtual environments, collaborative workspaces, collaborative wireless sensor networks, collaborative processing of Big Data, interoperability, ontology and semantics, security and privacy, as well as social aspects and human factors related to collaboration. Application domains include aerospace, automotive, manufacturing, construction, logistics, transportation, power and energy, smart home and intelligent building, healthcare and homecare, infrastructure, administration, social networks, and entertainment. We provide a forum for researchers and practitioners involved in different but related fields to confront research results and discuss key problems.


Members

  • Marie-Hélène Abel, Université de Technologie de Compiègne, France
  • Hamideh Afsarmanesh, University of Amsterdam, Netherlands
  • Rachid Anane, Coventry University, UK
  • Pedro Antunes, Escola Superior de Tecnologia de Setúbal, Portugal
  • Pierre-Emmanuel Arduin, Université Paris-Dauphine, France
  • Armand Baboli, Institut National des Sciences Appliquees de Lyon, France
  • Mert Bal, Miami University, USA
  • Nelson Baloian, University of Chile, Chile
  • Jinian Bian, Tsinghua University, China
  • Marcos Borges, Federal University of Rio de Janeiro, Brazil
  • Patrick Brezillon, University of Paris 6, France
  • Hongming Cai, Shanghai Jiaotong University, China
  • Xiantao Cai, Wuhan University of Technology, China
  • Luis Camarinha-Matos, Universidade Nova de Lisboa, Portugal
  • Stephen Chan, Hong Kong Polytechnic University, China
  • Kuo-Ming Chao, Coventry University, UK
  • Naoufel Cheikhrouhou, EPFL, Switzerland
  • Jessie Chen, US Army Research Lab, USA
  • Soumaya Cherkaoui, University of Sherbrooke, Canada
  • Chih-Hsing Chu, National Tsing Hua University, Taiwan
  • Graham Coates, Durham University, UK
  • Ruth Cobos, Universidad Autónoma de Madrid, Spain
  • Bertrand David, EC Lyon, France
  • Jano de Souza, Federal University of Rio de Janeiro, Brazil
  • Jinxiang Dong, Zhejiang University, China
  • Zhenhua Duan, Xidian University, China
  • Wenhui Fan, Tsinghua University, China
  • Shaw Feng, NIST, USA
  • Jinan Fiaidhi, Lakehead University, Canada
  • Susan Finger, Carnegie Mellon University, USA
  • Giancarlo Fortino, University of Calabria, Italy
  • Jean-Marc Frayret, University of Montreal, Canada
  • Alfonso Garcia Frey, Luxembourg Institute of Science & Technology, Luxembourg
  • Jerry Fuh, National University of Singapore, Singapore
  • Rajit Gadh, University of California, Los Angeles, USA
  • Liang Gao, Huazhong UST, China
  • Shuming Gao, Zhejiang University, China
  • Hamada Ghenniwa, University of Western Ontario, Canada
  • Ricardo Goncalves, Universidade Nova de Lisboa, Portugal
  • Nathan Griffiths, Warwick University, UK
  • Hansu Gu, Seagate Technology LLC, USA
  • Ning Gu, Fudan University, China
  • Antonio Guerrieri, University of Calabria, Italy
  • Bin Guo, Northwestern University, China
  • Soonhung Han, Korea Advanced Institute of Science and Technology, Korea
  • Qi Hao, National Research Council, Canada
  • Fazhi He, Wuhan University, China
  • David Hicks, Texas A&M University Kingsville, USA
  • Jiang-Liang Hou, National Tsing Hua University, Taiwan
  • Yeh-Liang Hsu, Yuan Ze University, Taiwan
  • Bin Hu, Birmingham City University, UK
  • Yaoping Hu, University of Calgary, Canada
  • George Huang, Hong Kong University, China
  • Tamoo Inoue, University of Tsukuba, Japan
  • Rahat Iqbal, Coventry University, UK
  • Anne James, Coventry University, United Kingdom
  • Pingyu Jiang, Xi'an Jiaotong University, China
  • Patricia M. Jones, University of Illinois at Urbana-Champaign, USA
  • Shugang Kang, Scientific Forming Technologies Corporation, USA
  • Peter Kroph, University of Neuchatel, Switzerland
  • Jean-Christophe Lapayre, UFC, France
  • Ching-hung Lee, Institute of Information Industry, Taiwan
  • Tae-Eog Lee, Korea Advanced Institute of Science and Technology, Korea
  • Bin Li, Fujian University of Technology, China
  • Weidong Li, Coventry University, UK
  • Wenfeng Li, Wuhan University of Technology, China
  • Xiaoping Li, Southeast University, China
  • Yingguang Li, NUAA, China
  • Yinsheng Li, Fudan University, China
  • Lanfen Lin, Zhejiang University, China
  • Antonio Liotta, Eindhoven University of Technology, Netherlands
  • Changqing Liu, NUAA, China
  • Jie Liu, Carleton University, Canada
  • Min Liu, Tongji University, China
  • Peter X. Liu, Carleton University, Canada
  • Xiaoping Liu, HFUT, China
  • Robert Lu, National Taipei University of Technology, Taiwan
  • Tun Lu, Fudan University, China
  • Yuhua Luo, UIB, Spain
  • Yongsheng Ma, University of Alberta, Canada
  • Zakaria Maamar, Zayed University, UAE
  • KL Mak, Hong Kong University, Hong Kong
  • Mary Lou Maher, University of Sydney, Australia
  • Sergio Medeiros, UFRJ, Brazil
  • Roc Meseguer, Universitat Politècnica de Catalunya, Spain
  • Xiaozhen Mi, Dialian Jiaotong University, China
  • Bernhard Mitschang, University Stuttgart, Germany
  • Sabah Mohammed, Lakehead University, Canada
  • Andrew Nee, National University of Singapore, Singapore
  • Vincent Ng, Hong Kong Polytechnic University, China
  • Sergio F. Ochoa, University of Chile, Chile
  • Eugenio Oliveira, University of Porto, Portugal
  • Jonice Oliveira, UFRJ, Brazil
  • Emerson Paraiso, PUCPR, Brazil
  • Hwa Gyoo Park, Soonchunhyang University, Korea
  • Willy Picard, KTI, Poland
  • Jose A. Pino, University of Chile, Chile
  • Michel Pouly, EPFL, Switzerland
  • Milton Pires Ramos, TECPAR, Brazil
  • Knauf Rainer, Technische Universität Ilmenau, Germany
  • Ramana Reddy, West Virginia University, USA
  • Miguel Redondo, UCLM, Spain
  • Hongliang Ren, National University of Singapore, Singapore
  • Debbie Richards, Macquarie University, Australia
  • Flavia Santoro, UNIRIOTEC, Brazil
  • Haifeng Shen, Flinders University, Australia
  • Jun Shen, UOW, Australia
  • Leonid Sheremetov, IMP, Mexico
  • Peng Shi, University of Adelaide, Australia
  • Yanjun Shi, University of Western Ontario, Canada
  • Carla Simone, UNIMIB, Italy
  • Dirk Soeffker, University of Duisburg-Essen, Germany
  • Giuseppe Stecca, CNR, Italy
  • Kenji Sugawara, Chiba Institute of Technology, Japan
  • Chengzheng Sun, Nanyang Technological University, Singapore
  • Hongbo Sun, Tsinghua University, China
  • Yuqing Sun, Shandong Unviersity, China
  • Cesar Tacla, SULBBS, Brazil
  • WenAn Tan, NUAA, China
  • Dunbing Tang, NUAA, China
  • Yong Tang, South China Normal University, China
  • Shaohua Teng, Guangdong University of Technology, China
  • Indira Thouvenin, UTC, France
  • Tetsuo Tomiyama, Delft University of Technology, Netherlands
  • Amy Trappey, National Tsing Hua University, Taiwan
  • Brigitte Trousse, INRIA Sophia Antipolis, France
  • Adriana Vivacqua, UFRJ, Brazil
  • Chun Wang, Concordia University, Canada
  • Hao Wang, CAS, China
  • Hongwei Wang, University of Portsmouth, UK
  • Lihui Wang, University of Skövde, Sweden
  • Weigang Wang, Manchester U, UK
  • Xiangyu Wang, University of Sydney, Australia
  • Zhelong Wang, Dalian University of Technology, China
  • Ruizhong Wei, Lakehead University, Canada
  • Deyi Xue, University of Calgary, Canada
  • Jun Yan, UoW, Australia
  • Chunsheng Yang, NRC, Canada
  • Shiqin Yang, Hosei University, Japan
  • Yun Yang, Swinburne University of Technology, Australia
  • Jianming Yong, University of Southern Queensland, Australia
  • Hyun Joong Yoon, Catholic University of Daegu, Korea
  • Muhammad Younas, Oxford Brookers University, UK
  • Yong Zeng, Concordia University, Canada
  • Xuanfang Zha, NIST, USA
  • Cheng Zhang, Xi’an Jiaotong-Liverpool University, China
  • Chris Zhang, University of Saskatchewan, Canada
  • Heming Zhang, Tsinghua University, China
  • Jun Zhang, Sun Yat-Sen University, China
  • Xiaodong Zhang, Beijing Telecom University, China
  • Xiaokun Zhang, Athabasca University, Canada
  • Yunfeng Zhang, National University of Singapore, Singapore
  • Qinghua Zheng, Xi'an Jiaotong University, China
  • Jiehan Zhou, Carleton University, Canada
  • Mengchu Zhou, New Jersey Institute of Technology Newark, USA
  • Haibin Zhu, Nipissing University, Canada
  • Jie Zhu, Southeast University, China
  • Khaldoun Zreik, University of Paris 8, France

Learn More

These tutorial materials provide more information on topics of interest to our technical committee.


Recent Activities

  • Planning and Organizing 2018 IEEE 22nd International Conference on Computer Supported Cooperative Work in Design (IEEE CSCWD 2018), Nanjing, China
  • Organizing 2017 IEEE 21st International Conference on Computer Supported Cooperative Work in Design (IEEE CSCWD 2017), Wellington, New Zealand
  • Organized 2016 IEEE 20th International Conference on Computer Supported Cooperative Work in Design (IEEE CSCWD 2016), Nanchang, China
  • Organized 2015 IEEE 19th International Conference on Computer Supported Cooperative Work in Design (IEEE CSCWD 2015), Calabria, Italy
  • Organized three special sessions at IEEE SMC 2016, Budapest, Hungary
  • Organized three special sessions at IEEE SMC 2015, Hong Kong
  • Organized Technical Committee Member Meeting at IEEE SMC 2016
  • Organized Technical Committee Member Meeting at IEEE CSCWD 2016
  • Organized Technical Committee Member Meeting at IEEE SMC 2015
  • Organized Technical Committee Member Meeting at IEEE CSCWD 2015
  • Guest edited a special section on Advances and Applications of Internet of Things for Smart Automated Systems for IEEE Transactions on Automation Science and Engineering, 2015-2016
  • Guest edited a special section on Service-Oriented Collaborative Computing for IEEE Transactions on Service Computing, 2015-2016
  • Annual international conferences on Computer Supported Cooperative Work in Design (CSCWD)
  • Annual Technical Committee member meetings at CSCWD conferences and IEEE SMC conferences
  • Special session(s) at annual IEEE SMC conferences
  • Special issues based on CSCWD conferences with the IEEE Transactions on Systems, Man, and Cybernetics: Systems (TSMCS) and Transactions on Human-Machine Systems (THMS) and other relevant journals

Join Us

  • Interact with researchers and practitioners within an established international collaboration network with a history of successful international annual conferences since 1996.
  • Exchange research ideas and developing international collaborative projects.
  • Publish research results in a timely manner through international conferences and journal special issues.
  • Demonstrate leadership by organizing special sessions at SMC and CSCWD conferences and editing journal special issues.
  • Meet old friends and make new ones from different parts of the world.

 


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