Welcome
to this issue of SMC e-Newsletter. I would like to take
this opportunity to put forward and discuss some important
results of the recently concluded “IEEE All Society
Research Project” that are directly related to
SMC e-Newsletter.
According
to these results, 44% of IEEE SMC society members who
responded to questionnaire (response rate was 37%) indicated
that they had not read the Newsletter. Though its being
a new publication may well be the main reason, this
survey outcome will definitely be considered as a wake
up call to find ways how it can get to be known more.
The responses from IEEE SMC society members about the
Newsletter are of immense significance and for sure
would be greatly influential in planning for the future
of this publication to deliver maximum reader satisfaction.
Only
a less than 5% of the society members who indicated
they read the Newsletter had expressed that the Newsletter
is “extremely useful”. This, not at all,
is a satisfying result since our goal is to make this
publication nothing less than “extremely useful”
to all society members. We have carefully studied all
the other responses and will readily endeavor to make
this publication an immense success.
In
response to the requests from SMC members regarding
the Newsletter, we will encourage SMC society “local
chapters” to report their activities, increase
the breadth and the depth of the contents, and include
more articles on applications and reviews. In addition,
I am hoping to put forward following suggestions at
the BOG meeting:
Consider
converting the Newsletter into an e-Magazine to encourage
submitting formal technical papers to this publication.
Reassess
the e-mail alert service that has been notifying society
members of new issues.
Feature
more commented highlights from SMC-A, SMC-B in the
Newsletter.
Seek
the possibility of opening a new section to include
publications that are lower than the transactions level
of specialized expertise, for instance, non-transactions
publications and/or selected papers from conferences
sponsored/cosponsored by IEEE SMC society.
I
would like to personally thank for your comments and
all responses about the Newsletter.
Tsu-Tian
Lee
Newsletter Editor, IEEE SMC
E-mail:ttlee@cn.nctu.edu.tw
